Method of making an interposer sub-assembly in a printed wiring board

ABSTRACT

The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional of application Ser. No. 09/871,556,filed May 31, 2001, now U.S. Pat. No. 6,545,226.

FIELD OF THE INVENTION

This invention relates to electronic sub-assemblies, and particularly tostructures comprising a printed wiring board laminate that iselectrically and mechanically connected through an interposer connectorto an area array device, such as another board, a module or other activeor passive device.

BACKGROUND OF THE INVENTION

The mechanical and electrical core of a computer system comprises aplurality of printed wiring boards interconnected with other boards ormodules and with other active or passive devices, such as diodes,semiconductors, capacitors and resistors. The success or failure of suchcomputer systems is dependent upon, among other factors, their abilityto operate without mechanical breakdowns and electrical failures.

One type of computer system is a microprocessor called a network server.A principal function of a network server is to achieve organizedchannels of communication between a plurality of personal computers. Italso serves to house many programs that it shares with the personalcomputers. Thus, the reliable operation of the server is critical to theoperation of an entire network of such personal computers.

The interconnection between the mating surfaces of a printed wiringboard and a module or other active or passive device may be providedthrough an interposer. An interposer is a structure that provideselectrical contact between two such devices (hereinafter referred to asarea array devices). These area array devices typically areapproximately parallel. The electrical connection between an area arraydevice and a printed wiring board is achieved by pressing the device andthe wiring board together with the thin conductive interposer betweenthe two. The interposer can include compressible conductive elastomers,coil springs or leaf springs to establish the electrical connectionbetween the wiring board and the other device.

The need for area array connectors is growing due to the increase ininputs and outputs on area array modules. An area array connector is atype of high-density, low inductance socket available from a number ofsuppliers. These connectors may be any one of a number of differenttypes. One such socket uses compressible ‘fuzz buttons’. These arecompressible wadded wires described, for example, in the followingpatents: U.S. Pat. No. 5,552,752; U.S. Pat. No. 5,146,453 and U.S. Pat.No. 5,631,446. These are small, irregularly wound and inter-twined padsor balls that are made of gold plated beryllium copper wool or goldplated molybdenum wire. These wadded wire balls are compressed in holesin the interposer, which is a thin sheet of insulative material thatseparates the printed wiring board from the area array device. The holesare arranged in a pattern that matches a pattern of conductive pads onthe surfaces of the printed wiring board and the area array device incontact with the interposer. In the assembly process, the ‘fuzz buttons’are compressed between the conductive pads, thereby providing electricalconnections between the pairs of pads on the two surfaces that areseparated by the interposer. Among the other types of connectors aremetal filled elastomers, such as those sold by Tyco Inc. (formerlyThomas & Betts) as Metal Particle Interconnect Elastomers. Metal springsare also used. These metal springs generally are leaf springs having anumber of geometries, such as C-shaped or V-shaped. Soldered connectionscomplicate the disassembly or separation of the printed wiring boardfrom the area array modules if repair or replacement is required.

A limitation of this type of interconnect technology is the inherentfailure rate that can be obtained while placing electrical contacts inseries. The intrinsic failure rate of electrical contacts in series canbe approximated by:

-   -   Failure rate=n·IFR, wherein        -   Failure Rate equals the contacts in series        -   n=number of contacts in series        -   IFR=intrinsic failure of each contact interface.            Therefore, addition of more electrical contacts in series            typically increases the failure rate of an electrical            circuit.

Land grid area array interposers have been described in which aninterposer is designed for electrically connecting an electrical deviceto a printed circuit board wherein the interposer has been fabricated toprovide adequate stand-off between the electrical device and the printedcircuit board to provide space for active and/or passive devices.

To provide a connection between a printed wiring board and another areaarray device (which may be a second printed wiring board) using a landgrid array (LGA) connector, a space of about 3 mm is needed to allowclearance for any active or passive devices, such as diodes, capacitorsand capacitors that are mounted on the surface of the board. An optionis to request the vendors of the connector to devise a custom connectorthat provides the needed height. As is well recognized, thecustomization of any piece of hardware or software can add appreciablyto the overall product development schedule, as well as the cost ofassembly and/or use.

BRIEF DESCRIPTION OF THE INVENTION

The present invention relates to an electronic sub-assembly and itsmethod of manufacture. The sub-assembly comprises a printed wiring board(PWB) having a first surface including a plurality of vias terminatingat electrical contacts at said surface. These contacts generally are inthe form of contact pads. A first area array device having a surface,including a plurality of electrical contacts, is spaced from the PWB. Aplurality of connectors electrically couple the electrical contacts onthe surface of the PWB to the electrical contacts on the surface of thefirst area array device. The printed wiring board typically has a secondsurface that includes a plurality of electrical contacts that arecoupled to the second surface of the PWB by a plurality of connectors.The vias extend through the PWB to form electrically conductive platedthrough holes.

In one embodiment, an interposer separates the first surface of theprinted wiring board from the surface of the first area array device. Asecond interposer may also separate the second surface of the PWB fromthe second area array device. Each of the interposers includes theconnectors that couple said printed circuit board to the respective areaarray device. The area array devices may be spaced a fixed minimumdistance from the printed wiring board, preferably a distance of about 3mm. The sub-assembly preferably uses connectors that are selected fromthe group consisting of compressible wadded wire contacts, metalsprings, filled conductive elastomers, solder balls and hard solderballs.

For ease of repair and replacement, the connectors are compressiblewadded wire having a first end soldered to said contact pads and asecond end compressed against the electrical contacts on the surface ofthe area array device. This allows the area array device to be easilydetached from the sub-assembly.

Means are also provided for maintaining a fixed minimum spacing betweenthe PWB and each area array device

The invention also relates to a printed wiring board sub-assembly. Theprinted wiring board has a first surface containing one or more viasextending from the first surface into the board, and a conductivecontact pad on the surface of the printed wiring board electricallyjoined to each of said vias. An interposer structure has a first surfacefacing the first surface of the printed wiring board, and a secondsurface. The structure includes a pattern of holes extendingtherethrough that correspond to the holes in the printed wiring board.Wadded wire electrical contacts are pressed into each hole in thepattern. Each of the electrical contacts has a first end that issoldered or is pasted to a contact pad on the first surface of theprinted wiring board. The second end of the wadded wire contact iselectrically coupled by compressive contact to a conductive lead on asurface of a module or another printed wiring board.

At least some of the vias typically extend through the board to formplated through holes that terminate at a second board surface. A secondinterposer structure can be joined to contact pads on the second surfacein a manner similar to that of the first interposer to provide aninterconnect to a second area array device.

In yet another embodiment, the invention relates to an electronicsub-assembly that comprises a PWB spaced a fixed minimum distance froman area array device, and the method of making the same. The printedwiring board has a first surface including a plurality of vias extendingfrom the surface into the board. A plurality of electrical contact padsare connected to each of the vias, at least some of the contact padsbeing offset from the corresponding vias. The area array device has asurface including a plurality of electrical contacts. The surface of thePWB and the surface of the area array device are spaced a fixed minimumdistance, preferably about 3 mm, from one another. A plurality ofconnectors electrically couple the contact pads on the surface of theprinted circuit board to the electrical contacts on the surface of thearea array device. The connectors are selected from the group consistingof compressible wadded wire contacts, metal springs, filled conductiveelastomers, solder balls and hard solder balls. The hard solder ballstypically are composed of copper balls coated with a layer containingtin. If normal solder balls are used, they may be embedded in anunderfill material filling the space between the printed wiring boardand the area array device. The wadded wire connectors, filled elastomersand metal springs typically are used by placing them in holes extendingthrough the interposer between the surface of the PWB and thecorresponding surface of the area array device. The interposer may alsocomprise a pair of plastic caps, each cap including a lip extending overan edge of the PWB.

In yet another embodiment, an electronic sub-assembly comprises aprinted wiring board having first and second generally planar surfacesand a plurality of vias terminating in electrical contact pads on thesurfaces. A first area array device has a generally planar surfacefacing the first generally planar surface of the printed wiring board.The surface of the array device has a plurality of electrical contactsthereon. A plurality of connectors electrically couple the electricalcontacts on the first surface of the printed circuit board to theelectrical contacts on the surface of the first area array device. Theseconnectors can be wadded wire contacts, metal springs, filled conductiveelastomers, solder balls or hard balls or combinations thereof. A firstinterposer separates the first surface of the printed wiring board fromthe surface of the first area array device a fixed minimum distance ofabout 3 mm. The interposer contains a pattern of holes corresponding inlocation to the contacts on the first surface of the printed wiringboard and the connectors are positioned in these holes. The sub-assemblyfurther includes a second area array device having a surface including aplurality of electrical contacts for electrically coupling the secondsurface of the printed circuit board to the second area array device. Asecond interposer separates the second surface of the printed wiringboard from the surface of the second area array device. As with thefirst interposer, the second interposer contains a pattern of holes.These holes correspond in location to the contacts on the second surfaceof the printed wiring board. A plurality of connectors are positioned inthe pattern of holes in the second interposer for electrically couplingthe electrical contacts on the second surface of the printed circuitboard to the electrical contacts on the surface of the second area arraydevice. At least some of the electrical contacts on one or both of thegenerally planar surfaces of the printed wiring board comprise contactpads that are offset from the corresponding vias in the printed wiringboard to which the contact pads are electrically connected. At leastsome of the connectors in the holes of said interposers have a first endsoldered or pasted to contact pads on a surface of the printed wiringboard, while the second end is pressed against the electrical contactson the generally planar surface of the corresponding area array devicewithout soldering or pasting. The invention also contemplates that thesecond interposer may separate the second surface of the printed wiringboard a fixed minimum distance of about 3 mm from the surface of thesecond area array device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a circuit board assembly using an interposer with wadded wireelectrical contacts compressed between two circuitized substratesaccording to the teachings of the present invention;

FIG. 2 shows a similar assembly with two interposers with wadded wireconnections between three circuitized substrates;

FIG. 3 shows a circuit board assembly using wadded wire contacts, and anunderfill material;

FIG. 4 shows another circuit board assembly using a stand-offinterposer;

FIG. 5 is a planar view of the interposer and printed circuit board ofFIG. 4;

FIG. 6 shows another circuit board assembly with C-spring connectors anda ball grid array using hard electrically conductive balls; and

FIG. 7 shows another circuit board assembly using conductive rubbercontact pads.

DETAILED DESCRIPTION OF THE INVENTION

Land grid area array interposers have been described in which aninterposer is designed and fabricated for electrically connecting anelectrical device to a printed circuit board wherein the interposer hasbeen specifically designed to provide adequate stand-off between anelectrical device and a printed wiring board to provide space for activeand/or passive devices mounted thereto.

Turning to the drawings for greater detail, FIG. 1 shows a circuit boardassembly comprising a printed wiring board 110 electrically connected toan area array device 112, such as a printed circuit board or module. Theprinted wiring board 110 includes a plurality of vias 120 extending fromthe surface 124 into the board. Conductive pads 122 are soldered, pastedor plated to the openings of each via 120 on the top surface 116 of thePWB 110, and pads 126 are soldered, pasted or plated to the bottomsurface 124 of the PWB 110.

An interposer sheet 130 is provided with holes 132 positionallycorresponding to the vias 120 on the bottom surface 124 of the PWB 110.Each hole 132 is filled with wadded wire 134. One end of the waddedwires in the interposer sheet 130 is placed in contact with the contactpads 126 on the bottom surface 124 of the PWB and is soldered thereto.

The area array device 112 contains electrical contacts or interfaces 148on the board surface facing the PWB 110. The contacts are positioned toabut the other end of the wadded wire contacts 134. The wadded wirecontact is compressed to the plated through hole 120 to form anelectrical contact from the pads 148 on the module 112 to the platedthrough hole 120 using a conventional clamping device of the typecommonly employed in the art. For purposes of illustration, the clampingpressure in FIG. 1 is shown by opposing arrows 100 and is capable ofevenly distributing clamping pressure to the mating surfaces of the PWB110, the area array device 112, and the two surfaces of the interposersheet 130. The clamping means 100 can, for example, comprise severalC-clamps placed around the edges of the mating surfaces sandwichedbetween backing plates (not shown). Instead, a plurality of bolts canextend through holes in the various layers of the sandwich and throughbacking plates, and can be secured by nuts to provide the clampingpressure.

In accordance with one embodiment of the invention, the solder is thenreflowed to form the electrical connection between the contact pad 126and the wadded wire 134 in the interposer 130. This then comprises theinterposer sub-assembly 144. However, the interface between the waddedwire and the contact pad 148 is not soldered and, thus, remainsseparable, relying only on the clamping pressure to maintain electricalcontact. This mechanical connection then facilitates the disassembly ofthe wiring board 110 and the area array device 112.

Referring now to FIG. 2, an interposer sub-assembly 244 comprises aninner PWB 210 containing a plurality of vias 220 extending between thesurfaces of the PWB to form plated through holes (PTH)s) 218. These PTHsjoin conductive pads 222 on the upper surface 216 of the PWB 210 tocorresponding conductive pads 226 on the bottom surface 224 of the PWB210. The upper pads 222 contact fuzz buttons 234 pressed into holes 242in interposer 240. The fuzz buttons, in turn, make electrical contactwith contact pads 246 on the upper area array device 214. The pads 226on the lower surface 224 of the PWB 210 are electrically andmechanically coupled to a lower area array device 212 through fuzzbuttons of wadded wire 234 compressed into holes 232 in the interposersheet 230. The electrical connections from wadded wire 234 to theconductive pad 226 and the wadded wire 234 to conductive pad 222 isaugmented with solder, conductive paste, or other permanent connectionto improve control reliability or improve handling by reducing thenumber of loose pieces. On the other hand, mechanically coupling thesub-assembly 244 to the area array devices without solder or pastefacilitates disassembly for repair and replacement. Another advantage ofthis system is increased design flexibility with minimum inventory.Modifications can be made in the thickness of the printed circuit board210 to allow the same interposers 230, 240 to accommodate multiplestandoff heights and/or component heights on devices 212, 214.

It should be understood that the invention can also be practiced byreplacing the fuzz buttons 234 with springs, such as C-springs made byIntercon Corporation, or by the use of electrically conductive polymersor solder balls or other means for effecting an electrical connectionbetween the PWB and the devices that are spaced from the PWB.

The present invention also relates to the use of a standard heightconnector to get a fixed minimum space between the printed wiring boardand the area array device. A 3 mm gap is adequate for many standarddevices used in the industry today. The PWB is a laminate structure thatcan be soldered to a daughter card using established processes. Thecontact pads have a dog-bone structure on both the top and the bottomsurfaces of the board, and these pads are electrically joined to theplated through holes. The plated through holes can be as small as 0.010″for an interposer thickness up to 0.110″. For greater thickness, largerPTHs are required.

Turning now to FIG. 3, a PWB 310 is shown between a lower area arraydevice 312 and an upper area array device 314. The PWB 310 is shown as alaminated structure comprising conductive metal layers 328 embedded in aprepeg. The PWB contains a plurality of vias extending through the PWBto form plated through holes 318 joining the upper surface 316 of thePWB with its lower surface 324. The PTHs 318 are joined to conductivepads 322 on the upper surface 316 and to corresponding conductive pads326 on the bottom surface 324. The pads 322 are offset from the vias 318in a so-called dog bone configuration. This permits the use of enlargedpads to establish electrical contact between the two surfaces of the PWBand the corresponding surfaces of the modules. The upper pads 322contact solder balls 360 which, in turn, make electrical contact withthe upper area array device 314. The solder balls are supported by useof an underfill material 370 in accordance with well establishedpractices. The underfill serves to reduce the creep of the solder ballsunder compression load and improves the fatigue life of the solder ballsdue to thermal strains. The pads 326 on the bottom surface 324 of thePCB are electrically connected to the lower area array device 312through fuzz buttons 334 compressed into holes 332 in the interposer 330in the manner previously described. As can be seen from the drawing,with the use of the dog bone configuration for the pads, it is notnecessary to have an exact alignment between the solder balls, theplated through holes and the fuzz buttons. It should be understood thatsolder balls, metal springs or other connectors can be substituted forthe fuzz buttons in the interposer.

To avoid the need to use an underfill material to control movement ofthe solder balls, a plastic comb structure as shown in FIGS. 4 and 5 maybe used. This structure provides a physical limit between a PWB 410 suchas a mother board and a mezzanine device 414. This plastic combstructure comprises a pair of plastic caps 480 to prevent the collapseof the solder balls 460 between the device 414 and the printed wiringboard 410 when the components are clamped together. Each cap includes alip 482 extending downward over the edge of the PWB. The lips serve toaccurately position the interposer with respect to the PWB and torestrict relative movement between these two components. The capsinclude a plurality of semi-circular cutouts 484 corresponding to theouter row of solder balls 460. The thickness of the caps is at least asgreat as the diameter of the solder balls. Thus, when the assembly isclamped together, the balls are not flattened or damaged by thecompressive forces. Furthermore, the caps 480 allow the area arraydevice 414 to be removed for purposes of rework or replacement.

The PWB 410 contains several conductive layers 428 laminated therein,and a plurality of plated through holes 418 extending therethrough.These holes 418 connect with conductive pads 426 on the bottom surface424 of the PWB 410. An interposer sheet 430 contacts the bottom surface424 and contains a plurality of holes 432 into which wadded wire fuzzbuttons 434 are pressed. The dog-bone shape of the pads 422, 426 permitsthe solder balls 460 and wadded wire 434 to make electrical contactthrough the conductive PTHs, even though the solder balls and the waddedwire are not located directly above or below the plated through holes.The caps 480 typically are added after the PWB 410 and the top module414 are soldered together and cleaned. Thus, even if the two memberscreep toward one another, there is a set limit, as determined by thethickness of the cap, that will keep them apart and will avoid anelectrical short between the solder balls.

FIG. 6 shows an arrangement wherein the deformable solder balls arereplaced by hard electrically conductive balls composed of, for example,copper cores plated with a surface layer of tin or a tin alloy. Thesub-assembly 644 comprises a printed wiring board 610, an array of hardelectrically conductive solder balls 662, and an upper device 614 asanother printed wiring board or a module. The PWB 610 contains aplurality of plated through holes 618 connected to a plurality ofconductive pads 622 arranged in a dog-bone pattern on the upper surface616 and to another set of offset pads 626 on its bottom surface 624. Aspreviously noted, this dog-bone arrangement of the pads eliminates thenecessity of placing the hard solder balls directly over the PTHs andthe C-springs directly beneath the PTHs. The hard balls 662 complete theelectrical contacts between the pads 622 and the module 614. The hardballs 662 resist collapse when the sub-assembly 644, the upper device614 and the lower device 612 are clamped together. With this arrangementof hard solder balls, no underfill material or plastic caps are neededto keep the solder balls from being collapsed under pressure. Thesub-assembly 644 is soldered and cleaned, and is then ready to beconnected to a lower device 612 via the land grid array connector. Forthis, an interposer sheet 630 contains a pattern of holes 632 containingC-springs 664. This construction allows a thick interposer sub-assemblyto be constructed with internal ground and power planes to reduce thenoise and inductance that are inherent in long electrical leads. Aspreviously described, the C-springs can be replaced with other types ofelectrical connectors, such a wadded wire, without departing from thepresent invention.

The electrical connectors through the interposer may be selected from anumber of different types. Among these are metal filled polymers. Othersare compressible wadded wires commonly referred to as fuzz buttons.Metal springs, as previously described, may also be used.

The interposer is generally planar and is made from plastic or similarmaterial having good mechanical strength and dimensional stability. Itusually is an insulator made from plastic material, such as apolyphenylsulfide resin known as Ryton R-4 sold by Phillips 66Corporation, or a liquid crystal polymer, such as VECTRA E130i availablefrom Hoechst Celanese Corporation. The interposer serves to electricallyand mechanically isolate the area array devices from the printed wiringboard.

Turning now to FIG. 7, another embodiment is shown wherein a thickinterposer 730 includes a plurality of holes extending therethrough,filled with a conductive paste 790, such as a cured silver filledelastomeric compound. Each hole is filled with a carefully controlledexcess of the compound which is then cured or hardened. Upon hardening,the excess forms a contact button 792 on the top surface of theinterposer and another contact button 794 on the bottom surface. Theinterposer is clamped between an upper area array device 714 and a lowerarea array device 712 to form a completed assembly. The various contactpoints on the two area array devices are not shown in the drawing. Theinterposer 730 and the contact buttons 792, 794 serve to maintain aminimum space of about 3 mm, for example, between the two area arraydevices.

The costs associated with the constructing and qualifying of specializedinterposers is reduced by following the teachings of the presentinvention. Further, variations in size and thickness from one interposerto the other are reduced. The invention utilizes the advantages ofmetal-to-metal contact throughout the system. It allows the use ofsolder joints in compression to improve their reliability.

The specific details and operation of the sub-assembly described hereinas well as the details of the various passive and active devices thatare used here are known to persons of ordinary skill in the art.Accordingly, these details do not comprise a part of the presentinvention, except to the extent that they and their operation have beenmodified to become part of the present invention.

While the invention has been described in combination with embodimentsthereof, it is evident that many alternatives, modifications, andvariations will be apparent to those skilled in the art in light of theforegoing teachings. Accordingly, the invention is intended to embraceall such alternatives, modifications and variations as fall within thespirit and scope of the appended claims.

1. A method of making a printed wiring board sub-assembly comprising:providing a first surface on the printed wiring board surface; providingone or more vias extending from the surface into the board; providing anelectrically conductive contact pad on the first surface of the printedwiring board connected to each via; providing a first interposerstructure having a first surface facing the surface of the printedwiring board, and a second surface, said interposer including a patternof holes corresponding to the vias in the printed wiring board, andelectrical connectors in each hole in the pattern; joining a first endof each connector in the interposer structure to a conductive pad on thefirst surface of the printed wiring board using solder or paste, andelectrically joining a second end of each connector by compressivecontact to a conductive lead on a surface of an array device.
 2. Themethod according to claim 1 including extending the vias through theprinted wiring board to form plated through holes: providing anelectrically conductive contact pad on the second surface of the printedwiring board connected to each of said plated through holes; providing asecond interposer structure wherein the second interposer structurecontains a pattern of holes corresponding to the contact pads on thesecond surface of the printed wire board; providing a connector in eachhole in the pattern; and joining a first end of each connector in thesecond interposer structure to each conductive pad on the second surfaceof the printed wiring board by soldering or paste.
 3. The methodaccording to claim 2 wherein a second end of each connector in thesecond interposer is electrically joined by compressive contact to aconductive lead on a surface of another module or another printed wiringboard.
 4. The method according to claim 2 wherein the holes in the firstand the second interposer structures extend straight through eachinterposer structure.
 5. A process for fabricating an electronicsub-assembly comprising the steps of: providing a printed circuit boardhaving a first surface and a plurality of vias terminating as electricalcontacts at said surface; providing a contact pad at the end of eachvia; providing an area array device having a surface facing the firstsurface of the board, said area array device having a plurality ofconductive input and output contacts on said surface; providing aninterposer structure between the printed wiring board and the area arraydevice, the structure having first and second surfaces and containing apattern of holes corresponding to the contact pads at the ends of thevias on the surface of the printed wiring board; providing a pluralityof connectors selected from the group consisting of compressible waddedwire contacts, metal springs, filled conductive elastomers, solder ballsand hard solder balls; and placing each connector in a hole in theinterposer structure to electrically interconnect the contact pads onsaid printed circuit board and the conductive contacts on said areaarray device.
 6. The method according to claim 5 wherein the pattern ofholes in the interposer structures extends straight through theinterposer structure.
 7. The process according to claim 5 furtherincluding: joining one end of a connector to each contact pad on thesurface of the printed wiring board using solder or a paste, and joininga second end of a connector to each conductive contact on the surface ofsaid area array device by compression.
 8. The process according to claim7 wherein the area array device is spaced a fixed minimum distance fromthe printed wiring board, as determined by the thickness of theinterposer structure.
 9. The process according to claim 5 furtherincluding: providing the printed wiring board with a second surface withthe vias extending through from the first surface to the second surfaceto form plated through holes; providing contact pads electrically joinedto the holes terminating at the second surface of the printed wiringboard; providing a second area array device facing the second surface ofthe interposer, said device having a plurality of conductive input andoutput contacts corresponding in location to the wire contacts in thesecond interposer; providing a second interposer structure having firstand second surfaces between the second surface of the board and thesecond area array device, the structure containing a pattern of holescorresponding in location to the pads at the ends of the plated holes onthe second surface of the printed circuit board, and placing theconnectors in the holes in the structure.
 10. A method of maintaining afixed minimum distance between a printed wiring board and an area arraydevice comprising: providing a printed wiring board having a firstsurface including a plurality of vias extending from said surface intothe board; providing a plurality of electrical contact pads on saidfirst surface connected to each of the vias, at least some of thecontact pads being offset from the corresponding vias to which thecontact pads are electrically connected; providing a first area arraydevice having a surface including a plurality of electrical contacts,said first surface of the printed wiring board spaced a fixed minimumdistance from the surface of the first area array device as determinedby an interposer separating the two surfaces, and inserting a pluralityof connectors in holes in the interposer for electrically coupling thecontact pads on the surface of the printed circuit board to theelectrical contacts on the surface of the first area array device. 11.The method according to claim 10 wherein the minimum fixed distance isabout 3 mm.
 12. The method according to claim 10 wherein the connectorsare selected from the group consisting of compressible wadded wirecontacts, metal springs, filled conductive elastomers, solder balls andhard solder balls placed in the holes extending through the interposer.13. The method according to claim 10 wherein the holes extend straightthrough the interposer.
 14. The method according to claim 10 wherein theconnectors are solder balls, and wherein the interposer is a combstructure comprising a pair of caps, the caps being sufficiently thickso as maintain the fixed minimum distance and to prevent collapse of thesolder balls during assembly of the printed wiring board and the areaarray device.
 15. The method according to claim 14 wherein the combstructure comprises a pair of plastic caps, each cap provided with a lipthat serves to position the caps with respect to the printed wiringboard.
 16. A process for fabricating an electronic sub-assemblycomprising the steps of: providing a printed wiring board having a firstand a second generally planar surface and a plurality of viasterminating as electrical contact pads at each said surfaces; providinga contact pad on the surface at the end of each via; spacing a firstarea array device having a generally planar surface facing the firstsurface of the board a fixed minimum distance of about 3 mm from theprinted wiring board, said area array device having a plurality ofconductive input and output contacts on said surface, at least some ofwhich correspond to the contact pads on the first surface of the printedwiring board; providing a first interposer between the printed wiringboard and the first area array device, said interposer structure havingfirst and second generally planar surfaces and containing a pattern ofholes corresponding in location to the contact pads at the ends of thevias on the first surface of the printed wiring board; providing aplurality of connectors to electrically interconnect the contact pads onsaid printed circuit board and the conductive contacts on said firstarea array device; incorporating each connector into one of the holes inthe first interposer structure; providing a second area array devicehaving a generally planar surface facing the second surface of theprinted wiring board, said second area array device having a pluralityof conductive input and output contacts, at least some of whichcorrespond to the contact pads on the second surface of the printedwiring board; providing a second interposer between the second surfaceof the printed wiring board and the second area array device, saidinterposer having first and second surfaces and a pattern of holescorresponding in location to the contact pads at the ends of the platedholes on the second surface of the printed circuit board and thecorresponding conductive input and output contacts on the second areaarray device; incorporating electrical connectors into the holes in saidsecond interposer; soldering or pasting one end of at least some of theconnectors of said interposers to said contact pads and using pressurecontact to join the other second end against the electrical contacts onthe generally planar surface of the corresponding area array device. 17.The process according to claim 16 wherein the second interposerseparates the second surface of the printed wiring board a fixed minimumdistance of about 3 mm from the surface of the second area array device.18. The method according to claim 16 wherein the pattern of holes in thefirst and the second interposers extends straight through eachinterposer.